QUALCOMM'S AUTOMOTIVE DESIGN-WIN PIPELINE EXPANDS TO $30 BILLION
>> Greater than 2X Increase in Pipeline Since November 2021 Snapdragon Digital Chassis Enables the Car of the Future
Qualcomm Incorporated announced at its inaugural Automotive Investor Day that the Company’s automotive design-win pipeline has grown to $30 billion1, driven by increased adoption of its Snapdragon® Digital ChassisTM solutions across the auto industry. The increase represents a greater than $10 billion expansion since the Company’s fiscal third quarter results were announced. Specifically, the expanded pipeline is a result of significant design wins with automakers and Tier-1 suppliers as Qualcomm Technologies, Inc. becomes the automotive industry’s partner of choice for next-generation vehicles.
“Qualcomm is a leader in essential technologies for the Connected Intelligent Edge,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “Our One Technology Roadmap scales across virtually every industry, including automotive. The Snapdragon Digital Chassis, combined with our relationships with automakers, has resulted in a $30 billion design-win pipeline. We are winning the digital future of automotive.”
At Automotive Investor Day, Qualcomm provided several key updates:
> Estimated Automotive TAM expansion to $100 billion by 2030
> Automotive design-win pipeline of $30 billion
> Strong QCT Automotive revenue growth from $975 million in FY21 to ~$1.3 billion in FY22e
> Increased QCT Automotive revenue growth forecast since November 2021 to greater than $4 billion in FY26e and greater than $9 billion in FY31e
> Introduced the industry’s first integrated automotive super-compute class System-on-Chip, the Snapdragon RideTM Flex SoC
Qualcomm Technologies and Mercedes-Benz also announced a collaboration to power upcoming Mercedes vehicles with Snapdragon Digital Chassis solutions.
Qualcomm is a leader in the automotive space and its Snapdragon Digital Chassis is the only open, scalable and upgradeable platform for next-generation vehicles.