INFINEON AND STELLANTIS AGREE ON MEMORANDUM OF UNDERSTANDING ON MULTI-YEAR DELIVERY OF SILICON CARBIDE (SIC) CHIPS

Munich, Germany – Infineon Technologies AG and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion.

“We firmly believe in electromobility and are excited to develop partnerships with leading automotive companies like Stellantis that make it a part of people’s everyday life,” said Peter Schiefer, Division President Automotive of Infineon. “Compared to traditional power technologies, silicon carbide increases the range, efficiency and performance of electric vehicles. With our leading CoolSiC™ technology and continuous investments in our manufacturing capacities, we are well positioned to meet the growing demand for power electronics in electromobility.”

Infineon and Stellantis are in talks about delivering the CoolSiC Gen2p 1200 V and CoolSiC Gen2p 750 V chips for electric vehicles under Stellantis brands. The unmatched performance, reliability, and quality of CoolSiC technology would allow Stellantis to build vehicles with longer ranges and lower consumption for the best user experience – and support the company in its efforts to standardize, simplify and modernize platforms.

Infineon has a market-leading role as a high-quality and high-volume supplier to the automotive industry. Infineon is preparing for the accelerated demand of the industry with significant investments. In 2024, for example, Infineon’s new fab for SiC technologies will start manufacturing in Kulim, Malaysia. It will complement existing manufacturing capacities in Villach, Austria, following Infineon’s multi-site strategy.

MATHWORKS SIMULINK PRODUCTS NOW SUPPORT INFINEON’S LATEST AURIX™ TC4X FAMILY OF AUTOMOTIVE MICROCONTROLLERS

Munich, Germany and Natick, MA – MathWorks and Infineon Technologies AG today announced a hardware support package for the MathWorks Simulink® products for Infineon’s latest AURIX™ TC4x family of automotive microcontrollers. Automotive engineers designing advanced electric vehicles, sensor fusion, and radar signal processing functions can use the hardware support package, even before silicon is available. With the package, they can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.

“Our newest AURIX TC4x microcontroller family will give customers unparalleled real-time safety and security performance,” said Marco Cassol, Director of Microcontroller Product Marketing for ADAS, Chassis and EE Architecture applications at Infineon Technologies. “Support for these chips from the widely used MathWorks capabilities for model-based design enables engineers to get an earlier start on pre-silicon software development and automate code generation to accelerate that development. The resulting time-to-market benefits could significantly impact our customers’ success.”

“This close collaboration with Infineon will enable our mutual customers to accelerate the pace of development of electric vehicle systems,” said Jim Tung, MathWorks Fellow. “Engineers can tackle complex systems while managing risk, with an improved understanding of system-level behavior, continuous verification, and a digital thread to requirements. We are proud to contribute to these activities that help make vehicles cleaner, more efficient, and more reliable.”

The MathWorks and Infineon partnership delivers capabilities that enable automotive engineers to accelerate the development of electric vehicle and driver-assistance functions. These capabilities simplify the development of increasingly complex automotive systems. Model-based design with MATLAB® and Simulink® can accelerate embedded-system development and verification by 30 to 40 percent over traditional approaches, making the seamless support of Infineon’s automotive microcontrollers valuable for engineers and researchers.

This is the latest in a series of collaborations between Infineon and MathWorks. Another recent example is the inclusion of Infineon’s SPICE models for the OptiMOS™ 5 MOSFET devices in MathWorks’ Simscape™ physical modeling environment, enabling faster design and effective control of electric motors for powertrain and cooling, pumps, and other automotive control features to increase efficiency and decrease CO 2 emissions.

INFINEON ACHIEVES ISO/SAE 21434 PROCESS CERTIFICATION; AURIX™ TC4XX MICROCONTROLLER FAMILY FIRST TO BE STANDARD-CERTIFIED

Munich, Germany – Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles. This regulation, which came into effect from July 2022, requires vehicle manufacturers to apply a security-by-design approach to their products and processes. To enable new vehicle sales in markets covered by the R155 regulation, the vehicle manufacturer must own a valid certificate of compliance for the cybersecurity management system (CSMS) applied to each vehicle type. To achieve certification, vehicle OEMs must implement cybersecurity practices across the supply chain to reduce the overall risk of attack throughout the vehicle lifecycle – from initial concept to end-of-life.

To help customers achieve compliance with national and international cybersecurity regulations such as UN R155, Infineon Technologies AG is one of the first semiconductor suppliers to achieve certification under ISO/SAE 21434, the new international standard for automotive cybersecurity management systems. The certification for this standard was carried out by TÜV Nord. In addition, Infineon’s upcoming AURIX™ TC4xx microcontroller family features a new and innovative cybersecurity architecture and is expected to achieve product certification under the ISO/SAE 21434 standard.

Infineon’s ISO/SAE 21434-compliant CSMS applies to a wide range of Infineon products supporting automotive cybersecurity, including AURIX™ and PSoC™ microcontrollers, SEMPER™ Secure flash memories, and OPTIGA™ hardware security modules. Following industry best practices, the CSMS covers information technology, manufacturing technology, and selected regional and regulatory environments.

Infineon’s threat monitoring system is able to actively analyze relevant vulnerability disclosures, and potential threats to Infineon security products and systems can be evaluated and mitigated based on an ISO/SAE 21434-compliant product security incident response process. Together, these ISO/SAE 21434-compliant monitoring and incident response capabilities enable Infineon and its customers to work in close cooperation to rapidly identify and mitigate product security risks in compliance with risk management programs and relevant regulations.

 
CERENCE
V2G
DRIVER MONITOR
BMSiC
AURIX™
ICMS
650 V COOLSIC™
ID.3 TOUR
AUTODRIVE PROJECT
HybridPACK™ DC6i
REE AUTOMOTIVE
RADAR